NEW AGENCY AGREEMENT AT LLOYD DOYLE
Electronics inspection equipment manufacturer
Lloyd Doyle announces a new agency agreement. Sigmatek
Corporation will be their new representative in
Richard Frisk, president of Lloyd Doyle commented
Sigmatek are well respected in the Taiwanese IC substrate market and will provide an
ideal partner to promote the IBIS system. 2007 will see a large increase in bumped
substrate manufacturing in this region.
The IBIS system uses emerging technology to
provide production volume solder bump inspection on the die attach side of chip carriers.
It is capable of scanning 3000 devices per hour and reporting on solder bump height,
circularity, co-planarity and volume. The system represents a breakthrough in inspecting
and measuring bump parameters accurately and at high speed enabling manufacturers to have
the capability for 100% inspection of solder bumps on chip carriers rather than only being
able to measure them under laboratory conditions.
© Lloyd Doyle