IBIS and VERSALEA - interferometric bump inspection system
IBIS is a brand new 3D inspection system designed to accurately measure solder bumps heights for IC substrate applications
To read about the IBIS system and it's capabilities, click here
For a datasheet, click here
For a technical presentation on IBIS, click here
VERSALEA is a development of IBIS which enables the 2D / 3D scanning of substrates and bumped wafers up to 300mm x 300mm.
For a datasheet on VERSALEA, click here
For a short video on VERSALEA scanning substrates, click here
For a technical presentation on VERSALEA, click here
